BIGTREETECH Upgrade Ender 3 Motherboard Silent Control Board SKR Mini E3 V2.0 32Bit with TMC2209 UART Stepper Driver 3D Printer Parts for Creality Ender3

2024-02-25 10:43:05







BIGTREETECH Upgrade Ender 3 Motherboard Silent Control Board SKR Mini E3 V2.0 32Bit with TMC2209 UART Stepper Driver 3D Printer Parts for Creality Ender3

Better Protection and Safety Design Increase the distance between the driving chip and the components to avoid the trouble caused by the heat sink. Two CNC Fan Interface Change an original frequent fan to a CNC fan, user-friendly. Power Chip Use MP1584EN power chip, support 12-24V power input, maximum output current up to 2.5A. Read more Add 5V Power Supply 5V power supply with BLTouch, TFT and RGB interfaces is optional. Read more Onboard Sensorless Homing Function You can use this function by plugging in the jumpcap, easy and convenient. Read more Connect with Power-off Resume Connect with BLTouch Connect with Automatic Shutdown Connect with Filament Detection Motherboard Parameters: Layer: 4 layers Power input: DC 12 / 24V Appearance size: 100.75 70.25mm Motor driver: UART mode of onboard TMC2209 Temperature sensor interface: TH0, THB, 2 channels 100K NTC (thermal resistance) Motor drive interface: XM, YM, ZAM, ZBM, EM Logic voltage: 3.3V Support file format: G-code MCU: ARM Cortex-M3 STM32F103RCT6 PC communication interface: Mini-USB-B type, easy to plug and unplug, communication baud rate 115200 Display: 2.4 inch TFT, 3.5 inch TFT, Ender3 original LCD12864 screen, etc Recommended software: Cura, Simplify3D, pronterface, Repetier-host, Makerware

Product Features

  • Main Control Chip FeaturesThis new SKR Mini E3 V2.0 motherboard uses the STM32F103RET6 main control chip, and its flash memory size is 512K.
  • CNC FanBecause the fan on the SKR Mini E3 V2.0 control board is a CNC fan, you need to set the wind speed before using it. (Note: V2.0 version of the fan is not ready to use after power on).
  • Hot-bed MosfetThe hot bed MOS tube uses WSK220N04, low on-resistance, larger heat dissipation area, and reduce heat generation.
  • Upgrade FeaturesSupport BLtouch, filament detection, power-off resume, automatic shutdown, etc .; Increase the distance between the driving chip and the components to avoid the trouble caused by the heat sink;

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