TF8 Thermal Compound Paste13.8 W/mK, Carbon Based High Performance, Heatsink Paste, Suit CPU for All Coolers, Thermal Interface Material with Tool（2g） 2g

TF8 Thermal Compound Paste13.8 W/mK, Carbon Based High Performance, Heatsink Paste, Suit CPU for All Coolers, Thermal Interface Material with Tool（2g）

Easy to Apply TF8 has ideal consistency and is very easy to use even for beginners. Its application possibilities and the most effective way to avoid the gap between the CPU and the heat sink. Perfect performance TF8 thermal conductivity: 13.8 W/mK (MX-4 only 8.5 W/mk). The heat generated by the CPU or GPU can be dissipated quickly and efficiently, and is even suitable for overclocking. Safe Application It does not contain any metal particles, so conductivity will not be a problem. Unlike silver and copper compounds, it can ensure that contact with any electrical pin will not cause any form of damage.

Product Features

• High thermal conductivity: It is composed of carbon particles and has a high thermal conductivity. It can ensure that the heat generated by the CPU or GPU is effectively dissipated.
• Safety application: TF8 has no metal and no conductivity, which eliminates any risks caused by short circuits, and can better protect the CPU and VGA card.
• High durability: Contrary to the thermal conductive glue of metal and silicon, TF8 will not become unstable with time, and it is very durable, which also prolongs its use time.
• Easy to use: TF8 is very easy to operate even for beginners.
• Quality Reliable: There are strict quality controls in the production process, so you can use it with confidence.

Tags:cocoon

Size - 2g